Communication Equipment Data Center Intelligent Terminal Power Components
Solution Introduction
In the process of rapid development of global mobile communication networks, the functions of 5G/6G communication equipment and intelligent terminals, data centers, power components and other equipment are becoming increasingly powerful. Accompanied by the exchange and processing of massive data, and with equipment becoming more and more integrated and compact, the challenges for electronic engineers and structural engineers are also increasing. Along with a series of changes and developments, our product system is also constantly developing and innovating. Vitco can provide professional high-reliability, high electrical performance and high-precision electronic assembly materials (solder paste, solder wire, solder bar, solder preforms, flux, cleaning agent) and reliability materials (conformal coating, adhesives, thermal interface materials, nano-coating), etc.
Key Focus
Support the precision design requirements of circuit boards
Communication equipment
Data center
Smart terminal
Power supply components
Material Solutions:
Solder Paste
WTO-LF9400GF series, WTO-LF4000A series, SAC305YM333 series
Suitable for precise printing of high-density BGA arrays and fine-pitch PCB designs. Can perform 3*8 (hours) continuous printing while ensuring excellent print forming and high reflow yield.
Solder Preforms
Solder preforms are typically used in situations where there are special requirements for the shape and quality of solder. They can be made into any shape and size to meet specific needs. Common shapes include round washers, discs, rectangles and frames, etc. Vitco can provide product customization services according to your actual needs.
Flux
WTO-516, WTO-616HF, WTO-618E
High purity raw materials, suitable for scenarios with special requirements for solder joint shape and quality.
Semi-aqueous Cleaning Agent
GW2012N, GW2066H, GW5066B
Efficiently cleans all types of FPC flexible boards, ensuring product service life and safety.
High-performance Thermal Pads
WTO-S5401 (3.5W), WTO-S5402 (8W), WTO-S5403 (2W), WTO-S5406 (1.5W), WTO-S5408 (10W)
Silicone thermal pads are a soft thermal pad material that not only has good conformability and effectively reduces interface thermal resistance, but is also easy to operate due to its natural tackiness. Thermal pad materials can also achieve ultra-high thermal conductivity performance according to different formulations, making them an ideal choice for thermal gap filling.
High-performance Thermal Gel
TC9300 (3.74W), TC9600 (6W), TC9800 (8W), TC9900 (10W)
TC series thermal gel is designed for high-performance devices pursuing excellent heat dissipation performance. Each product in this series is designed to meet specific heat dissipation needs, ensuring that devices operate stably and reliably in complex environments.
Electronic Adhesives
Underfill UF8001/UF8002/UF8011, solid underfill, UV adhesive, potting compound, etc.
Compliance with various environmental and regulatory requirements
Continuous innovation to help our partners achieve truly lead-free and green production.
Products compliant with RoHS and REACH standards.
A wide variety of low and no VOC flux.
Various halogen-free solder pastes and fluxes.
