MATERIALS SOLUTION FOR COMPUTER & SERVER
Professional Electronic Component Materials
As the graphics processing and data computing performance of computers and servers become faster and more complex, highly reliable and precise electronic component materials are required in the design and manufacturing of computer equipment, achieving high productivity and high stability products in the manufacturing process.
COMPUTERS
SERVERS
NETWORK EQUIPMENT
COMPUTER PERIPHERALS
Improving Equipment Stability and Lifespan
Today, whether for personal computers or supercomputers, intensive computing and massive data processing require computing equipment with ultra-high stability, which necessitates the use of more reliable electronic soldering materials, thermal conductive materials, and electronic adhesives to meet the electrical and structural performance requirements of equipment. Vitrocol provides professional materials and material solutions for world-renowned brands of computers, servers, and computer peripherals.
Material Solutions
Comprehensive range of professional materials designed for high-performance computing applications
Lead-free Solder Paste
This SAC lead-free solder paste can effectively reduce the head-on-pillow effect caused by CPU design or manufacturing process warpage during BGA soldering. At the same time, this product has excellent performance, is suitable for high-density BGA array scenarios, and can solve the hollow void defect problem in small-size BGA reflow process.
Low-temperature products WTO-LF2001/2002 series
SnBi35/58 series
WTO-LF4000A-DS series
SAC305YM333 series
WTO-LF9400GF series
WTO-LF3800 series
Organic Solvent Cleaner
Easy to volatilize, high cleaning efficiency, complies with environmental regulations.
WTO-4230 series
Flux
Effectively reduces surface tension between the solder mask and solder, reduces the generation of solder balls, and reduces the impact on probe testing.
WTO-518G
SnBi35/58 series
Thermal Interface Materials
Thermal Pads
High conductivity
Thermal Insulation Sheets
Heat isolation
Thermal Grease
Gap filling
Thermal Gel
TC9600 (6W) / TC9300 (3.74W)
Phase Change Materials
State transition
Graphite Materials
Superior spreading
Electronic Adhesives
Professional adhesive solutions for electronic component bonding and protection.
Lead-free Solder Paste
This SAC lead-free solder paste can effectively reduce the head-on-pillow effect caused by CPU design or manufacturing process warpage during BGA soldering. At the same time, this product has excellent performance, is suitable for high-density BGA array scenarios, and can solve the hollow void defect problem in small-size BGA reflow process.
Underfill adhesive UF8001
Underfill adhesive UF8002
UF8011 solid underfill adhesive
UV adhesive
Potting adhesive
etc
Reducing Total Manufacturing Costs
Vitrocol implements scientific cost control in every aspect from material R&D, process design, intelligent and automated production management, transportation, and product delivery, providing customers with high cost-performance products and helping to enhance customer product competitiveness.
Low-cost Material Solutions
Low-silver Solder Paste
SAC105YM103-CY
SAC0307YM333
WTO-LF9400-GF series
Achieves fine-pitch design printing process with less post-soldering residue.
long warranty
GW0307, GW007 series
GW105 series
Fast wetting and extremely low spatter, excellent performance, no sticky transparent residue.
24H Online Service
GW007, GW0307
GW105 series
Achieves fine-pitch design printing process with less post-soldering residue.
Global Shipping
WTO-209 series
GW2068 series
Strong cleaning power, no white residue after cleaning.