High-Reliability Lead-Free Solder Paste
No-clean lead-free solder paste, formulated with high-reliability flux featuring excellent wetting and solderability, combined with lead-free alloy powder of high sphericity and low oxygen content, scientifically blended. It meets the soldering requirements of lead-free solder and is an ideal environmentally friendly no-clean lead-free solder paste for use with lead-free soldering processes.
Product Features
Flux system uses scientifically selected materials, specifically developed for lead-free solder (SnAgCu system), effectively reducing solder surface free energy, decreasing surface tension, and enhancing the flowability and solderability of molten solder.
Wide reflow process window, achieving excellent soldering results across a wide temperature range.
Minimal post-soldering residue, no-clean; excellent ICT test performance, high surface insulation resistance, reliable electrical properties.
Excellent continuous printing performance, strong volatilization resistance, suitable for fine-pitch printing; superior stencil release/demolding properties, strong adhesion, resistant to slumping.
Superior solderability: solder joints are full, bright, with strong solder penetration and low soldering defect rate.
Contains no RoHS prohibited substances, environmentally friendly no-clean solder paste.
Product Applications
Compatible with PCB boards with bare copper, gold-plated, HASL (Hot Air Solder Leveling), OSP (Organic Solderability Preservative), and other surface treatments, as well as lead-free alloy components. Widely used in computer motherboards, mobile phone motherboards, MP3/MP4 communication equipment, audio-visual equipment, refrigeration equipment, automotive equipment, instruments and meters, medical equipment, and other high-reliability electronic and electrical products.
Safety
A small amount of volatile gas is produced during the reflow soldering process; ventilation equipment is required to prevent gas dispersion. For detailed safety data, refer to the "Material Safety Data Sheet (MSDS)."
Application Guidelines
1. Storage and Use
Storage conditions:Store sealed at 0-10°C, shelf life 3-6 months (from production date, varies slightly by product model).
Warming requirements:Remove from refrigerator before use and allow to warm to room temperature completely with the cap still sealed.
Stirring requirements:After warming, stir with manual/automatic mixer for 1-3 minutes (adjust time based on rotation speed and temperature) to ensure uniform mixing of flux and alloy powder.
Post-opening handling:Used solder paste should not be mixed with unused solder paste; after opening, tightly seal the cap on remaining solder paste, avoid leaving open.
2. Printing
Squeegee:Stainless steel/polyurethane material, printing angle 40°-60°.
Printing method:Supports manual, semi-automatic, and fully automatic machine printing.
Printing speed:Depends on product model.
Dwell time:Complete placement and soldering within 8-12 hours after printing to avoid affecting results.
Environmental conditions:Temperature 25±5°C, relative humidity 50±10%.
3. Packaging
500g/bottle
4. Reflow Profile (Actual Temperature on Soldered Surface)
Heating rate:≤4°C/S
Soak zone:150-180°C, duration 60-120S
Reflow zone:≥217°C, duration 40-100S
Peak temperature:238-250°C
Cooling rate:≤4°C/S, duration 40-100S
This product can be widely applied in SMT processes, compatible with soldering from standard-size components (such as 0603, 0402, 0.5Pitch BGA) to fine-pitch components (such as 0201, 01005, 0.4Pitch BGA, 0.3Pitch BGA).
Product Evaluation Indicators
| Type | Item | Performance | Test Method |
|---|---|---|---|
| Solder Powder | Alloy composition | SnAgCu | -- |
| Melting point | 217-222°C | DSC | |
| Powder shape | Spherical | SEM | |
| Particle size | T4 (25-38μm), T5 (15-38μm) | SEM + Laser method | |
| Flux Properties | Flux type | RO | J-STD-004 |
| Flux activity | L0 or L1 | J-STD-004 | |
| Halide content | 0% or < 0.5% | J-STD-004 | |
| Halogen content | No addition; or Cl<900ppm, Br<900ppm, Cl+Br<1500ppm | J-STD-004 | |
| Surface insulation resistance | >1×10⁹Ω | J-STD-004 | |
| Electrochemical migration | Pass (no migration) | J-STD-004 | |
| Copper mirror corrosion | Pass | J-STD-004 | |
| Fluoride test | Pass | J-STD-004 | |
| Solder Paste Properties | Viscosity | 170±30Pa.S | J-STD-004 |
| Thixotropic index | 0.4-0.6 (varies slightly by product series) | J-STD-004 | |
| Flux content | 11.5±1% | J-STD-004 | |
| Slump performance | Maximum 0.3mm | J-STD-004 | |
| Adhesion | ≥1.3N (after 24H) | JIS Z 3284 | |
| Copper board corrosion | Pass | J-STD-004 | |
| Shelf life | 6 months (unopened, stored at 0-10°C) | -- |
Product Model Parameter Table (I)
Tip: Scroll horizontally to view all parameter columns.
| Manufacturing Model | Alloy | Halogen | Powder Size | Product Features | Viscosity (Pa.s) | Metal Content (%) | Flux Content (%) | SIR (Ω) | Rec. Printing Speed (mm/sec) | Stencil Life (H) | Storage Temp (°C) | Storage Time (mo) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| WT0-LF-9400-GF | SAC305/SAC105/SAC307 | ROL0 | T4/T5 | 1. Excellent SP1 first-pass printing yield; 2. Bright solder joints, colorless transparent residue; 3. Minimal residue after reflow soldering; 4. Full side wetting on OF/NF with no voids; 5. Low corrosion, low residue; 6. Compatible with OSP-ENIG-HASL processes. | Printing: 160±20, Dispensing: 60-130 (10rpm/min) | 88.00±2.0 | 12.00±2.0 | ≥1×10¹⁰ | 20-100 | 8 | 0-10 | 6 |
| WT0-LF-4000-ADS / WT0-LF-4000-ADY | SAC305 | ROL1 | T4/T5 | 1. Excellent SP1 first-pass printing yield; 2. Bright post-soldering, yellow residue; 3. Compatible with ultra-fine pitch products, medium side wetting on OF/NF; 4. Compatible with OSP-ENIG-HASL processes. | 190±20 (10rpm/min) | 88.50±0.5 | 11.50±0.5 | ≥1×10¹⁰ | 20-100 | 8 | 0-10 | 6 |
| WT0-LF-1001F | SAC305/SAC105/SAC307 | ROL0 | T4 | 1. Compatible with lead-free process, environmentally friendly no-clean; 2. Excellent soldering results across wide reflow temperature range; 3. High surface insulation resistance, reliable electrical properties. | 170±30 (10rpm/min) | 88.75±0.5/88.5±1.0 | 11.30±0.5/11.5±1.0 | ≥1×10¹⁰ | ≤80/20-100 | 8 | 0-10 | 6 |
| WT0-LF-4000A-HRC / WT0-LF-4000A-HRB | SAC305/SAC105/SAC307 | ROL0 | T4 | 1. Lead-free system with halogen-free flux; 2. Excellent continuous printing, suitable for high throughput; 3. Full, bright solder coverage post-soldering; 4. Wide reflow window, compatible with BGA/CSP/QFN and other packages. | 170±30 (10rpm/min) | 88.5±1.0 | 11.5±1.0 | ≥1×10¹⁰ | 20-100 | 8 | 0-10 | 6 |
| WT0-LF-9600-HR | SnAg3.4Cu0.75 | ROL0 | T4 | 1. Excellent continuous printing; 2. Excellent soldering results across wide reflow temperature range; 3. Superior solderability, low defect rate; 4. Reliable electrical properties. | 170±30 (10rpm/min) | 88.5±1.0 | 11.5±1.0 | ≥1×10¹⁰ | 0-40 | 8 | 0-10 | 6 |
| SAC305YM101 | SAC305/SAC307 | ROL1 | T4 | 1. Excellent SP1 first-pass yield for fine-pitch printing; 2. Bright solder joints, colorless transparent residue; 3. Dedicated for precision products such as mobile phones/smartwatches. | 190±30 (10rpm/min) | 88.30±0.5 | 11.70±0.5 | ≥1×10¹⁰ | ≤80 | 8 | 0-10 | 6 |
| SAC305NM333 | SAC305 | ROL0 | T4/T5 | 1. Excellent printing stability; 2. Excellent ICT test performance. | 190±30 (10rpm/min) | 88.50±2.0 | 11.50±2.0 | ≥1×10¹⁰ | ≤80 | 8 | 0-10 | 6 |
| WT0-LF-2000 | SAC305 | ROL1 | T3/T4 | 1. Classic mature product; 2. Excellent SP1 first-pass printing yield; 3. Compatible with OSP-ENIG processes; 4. Good post-soldering expansion and contraction, suitable for automotive connectors; 5. Excellent shielding effect. | 170±30 (10rpm/min) | 88.60±0.3 | 11.40±0.3 | ≥1×10¹⁰ | 20-100 | 12 | 0-10 | 6 |
| WT0-LF-9400-LV | SAC305/SAC105/SAC307 | ROL0 | T4/T5 | 1. Excellent SP1 first-pass printing yield; 2. Bright solder joints, colorless transparent residue; 3. Full side wetting on OF/NF with no voids; 4. Low corrosion, low residue; 5. Compatible with OSP-ENIG-HASL processes. | Printing: 160±20, Dispensing: 60-130 (10rpm/min) | 88.50±2.0 | 11.50±2.0 | ≥1×10¹⁰ | 20-100 | 8 | 0-10 | 6 |
| WT0-LF-6000A-DAN | SAC305 | ROL1 | T5 | Pending customer on-line testing (excellent laboratory data) | 50±50 (10rpm/min) | 86.00±2.0 | 14.00±2.0 | ≥1×10¹⁰ | - | 8 | 0-10 | 3 |
| WT0-LF-8000-S | SAC305 | ROL1 | T6 | 1. Dedicated for ultra-fine pitch MINILED printing; 2. Excellent fixed-point ultra-high precision printing performance; 3. Excellent high-temperature oxidation resistance. | 130±30 (10rpm/min) | 87.00±2.0 | 13.00±2.0 | ≥1×10¹⁰ | - | - | 0-10 | 6 |
| SAC307YM101-Cl | SAC307 | ROL1 | T3 | 1. Good printing/viscosity stability, colorless transparent residue; 2. Good heat resistance, suitable for LED industry. | 200±30 (10rpm/min) | 88.30±0.5 | 11.70±0.5 | ≥1×10¹⁰ | ≤80 | 8 | 0-10 | 6 |
| WT0-LF-8300 | SAC307 | ROL1 | T3/T4 | 1. Moderate activity, general-purpose applications; 2. Soldering-friendly, low voids. | 170±30 (10rpm/min) | 88.00±0.5/88.20±0.5 | 12.00±0.5/11.80±0.5 | ≥1×10¹⁰ | ≤100 | 8 | 0-10 | 6 |
| WT0-LF-6000A | SAC105 | ROL1 | T3/T4 | 1. Good print formation, moderate activity, excellent shielding frame spreadability; 2. Side wetting height > 50%. | 190±30 (10rpm/min) | 88.40±0.3 | 11.60±0.3 | ≥1×10¹⁰ | 20-100 | 12 | 0-10 | 6 |
| WT0-LF-2002 / WT0-LF-2002-W | Sn64Bi35Ag1 | ROL1 | T3/T4 | 1. Moderate activity, good flowability, suitable for medium-temperature applications; 2. Compatible with printing and spot welding. | 150±30 (10rpm/min) | 89.40±0.3 | 10.60±0.3 | ≥1×10¹⁰ | 20-100 | 12 | 0-10 | 6 |
| SnPb35Ag1YM501 | Sn64Bi35Ag1 | ROL1 | T3 | 1. Moderate activity, suitable for SMT printing, no soldering issues; 2. Good anti-slump/wetting properties, full solder joints. | 170±30 (10rpm/min) | 88.20±0.5 | 11.80±0.5 | ≥1×10¹⁰ | ≤80 | 8 | 0-10 | 3 |
| SnPb58-YM520 | Sn42Bi58 | ROL1 | T3/T4 | 1. Halogen-free, suitable for SMT through-hole/heat sink processes; 2. Good anti-slump/wetting properties, full solder joints. | Bottle/Syringe: 160±20, Syringe: 100±30 (10rpm/min) | 88.00±0.5 | 12.00±0.5 | ≥1×10¹⁰ | ≤80 | 8 | 0-10 | 6 |
Solder Paste for Segmented Industries
Specialized solder paste formulations designed for specific industry requirements and challenging applications.
Product Model Parameter Table (II)
Tip: Scroll horizontally to view all parameter columns.
| Category | Manufacturing Model | Alloy | Halogen | Powder Size | Product Features | Viscosity (Pa.s) | Metal Content (%) | Flux Content (%) | SIR (Ω) | Rec. Printing Speed (mm/sec) | Stencil Life (H) | Storage Temp (°C) | Storage Time (mo) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LED Dedicated Solder Paste | WT0-LF-930-JC3 | Lead-free multi-element alloy (170/180/190) | ROL0 | T4/T5 | 1. Excellent SP1 first-pass printing yield; 2. Solder joint shear strength superior to conventional SnAgBiCu; 3. Bright solder joints, colorless transparent residue; 4. Widely compatible with LED displays. | Printing: 170±30, Dispensing: 70±20 (10rpm/min) | 88.00±2.0 | 12.00±2.0 | ≥1×10¹⁰ | 20-100 | 8 | 0-10 | 6 |
| High-Silver Solder Paste | SnPb37YM800 / SnPbAgYM880 / SnPbBiYM800 | Modified silver powder (SnPbAg4.0/1.2) | ROL0 | T3/T4/T5 | 1. Anti-bridging, excellent continuous printing/solderability; 2. Compatible with LED assembly processes; 3. Specifically developed for LED heat sink low-temperature packaging/PCB secondary assembly. | 190±30/160±30 (10rpm/min) | 90.00±1.0 | 10.00±1.0 | ≥1×10¹⁰ | 20-100 | 8 | 0-10 | 6 |
| LED Flexible Strip Solder Paste | WT0-LED-F / WT0-LED-2F | Sn3.4Ag3Bi1.4/Sn5.0Bi4.5Bi5 | ROL1 | T3/T4 | 1. Strong activity, high soldering strength, compatible with different copper pads; 2. Wetting soldering for different pitch displays. | 110±80 (10rpm/min) | 89.70±0.5/88.00±2.0 | 10.30±0.5/10.30±0.5 | ≥1×10¹⁰ | 20-100 | 12 | 0-10 | 6 |
| Laser Solder Paste | SAC305YM300LS/AB | SAC305 | ROL0 | T4 | 1. Bright solder joints, good wetting, suitable for strip soldering; 2. High stability, strong environmental adaptability. | 100±30 (10rpm/min) | 86.00±0.3 | 14.00±0.3 | - | ≤100 | 8 | 0-10 | 6 |
| Laser Solder Paste | WT0-LF-2000-JC5 | SnAgCu/SnBiAg | ROL0 | T3/T4/T5 | 1. Controllable viscosity, compatible with dispensing/printing processes; 2. Good solderability, suitable for 300-second long soldering time; 3. Minimal organic residue, transparent, no-clean. | 30±10 (10rpm/min) | 86.00±3.0 | 14.00±3.0 | ≥1×10¹⁰ | - | 4 | -10-2 | 3 |
| Heat Sink Dedicated Solder Paste | SnPb58YM520-2B | Sn42Bi58 | ROL0 | T3 | 1. Halogen-free, suitable for SMT through-hole/heat sink processes; 2. Good anti-slump/wetting properties, full solder joints. | Bottle/Syringe: 190±30, Syringe: 100±30 (10rpm/min) | 90.00±0.5/88.00±0.5 | 10.00±0.5/12.20±0.5 | ≥1×10¹⁰ | ≤80 | 8 | 0-10 | 6 |
| Heat Sink Dedicated Solder Paste | WT0-LF-2001-7 / WT0-LF-2001-6B / WT0-LF-2001-6C | Sn42Bi58 | ROL0 | T3 | 1. Good activity, reliable soldering; 2. Direct preheat connection, minimal soldering spread; 3. Minimal post-soldering residue, no copper whiskers; 4. Does not corrode tin. | 150±30 (10rpm/min) | 90.80±3.0 | 9.20±3.0 | - | 20-100 | 8 | 0-10 | 6 |
| Heat Sink Dedicated Solder Paste | SnPb58-YM520 | Sn42Bi58 | ROL0 | T3 | 1. Halogen-free, suitable for SMT through-hole/heat sink processes; 2. Good anti-slump/wetting properties, full solder joints. | Bottle/Syringe: 190±30, Syringe: 100±30 (10rpm/min) | 90.00±0.5/88.00±0.5 | 10.00±0.5/12.20±0.5 | ≥1×10¹⁰ | ≤80 | 8 | 0-10 | 6 |
| Heat Sink Dedicated Solder Paste | WT0-LF-2001-SS / WT0-LF-2001-FR | Sn42Bi58 | ROL1 | T3 | 1. Good solderability, suitable for backplane soldering; 2. High pin pull strength, suitable for high pull-strength products. | 150±30 (10rpm/min) | 90.60±0.5 | 9.40±0.5 | - | ≤80 | 8 | 2-10 | 6 |
| BC Process Solder Paste | GW0909-GF | SnCu3P37/Sn62.8Pb36.8Ag0.4/Sn62.9Pb36.9Ag0.2 | ROL1 | T3/T4/T5 | Good copper encapsulation, no solder overflow, suitable for long hot pocket machine/chip protection. | 110±30 (10rpm/min) | 88.50±0.5 | 11.50±0.5 | ≥1×10¹⁰ | ≤80 | - | 0-10 | 6 |
| Terminal Connector Solder Paste | GW0908 | SnBiAg37/Sn62.8Pb36.8Ag0.4/Sn62.9Pb36.9Ag0.2/Sn3Ag4Pb8814 | ROL0 | T3/T4/T5 | 1. Excellent soldering performance; 2. Suitable for leaded process terminal connector soldering; 3. Compatible with IBCT process. | 100±80 (10rpm/min) | 89.50±1/89.00±1 | 10.50±1/11.00±1 | ≥1×10¹⁰ | - | - | 0-10 | 6 |
| Wafer Solder Paste | WT0-LF-9000-DA0 | SAC305/SnPb35Ag1 | ROL0 | T5/T6/T7 | Uniform solder dots, does not dry out during long-term recrystallization, low void rate. | 40±20 (10rpm/min) | 84.00±2.0 | 16.00±2.0 | ≥1×10¹⁰ | - | - | 0-10 | 3 |
| Discrete/Power Device Solder Paste | WT0-LF-9600-GY / WT0-LF-9600-GZ / WT0-LF-9600-GD | SnPb92.5Ag2.5/Sn10Ag90/Sn6Ag96 | ROL0 | T3/T4/T4/T5 | 1. Excellent wetting force, transparent colorless residue post-soldering; 2. Uniform long-term aging, excellent adhesion, no post-soldering bubbles. | 30±170/30±170/30±100 (10rpm/min) | 87.00±3.0/87.00±2.0/87.00±2.0 | 13.00±3.0/13.00±2.0/13.00±2.0 | ≥1×10¹⁰ | 20-100/-/- | 8/8/8 | 0-10 | 6/6/6 |
| Soft Solder Paste | SC.0.YM1116WS / SAC305YM1116WS | Sn09.3Cu0.7/Sn6.5Ag3.0Cu0.5 | ROL0 | T4/T4/T5/T6 | 1. Excellent printing performance for micro components; 2. Good wetting performance/capability; 3. Compatible with multiple lead-free alloys and surface treatments; 4. Residue is water-washable. | 200±20/200±30 (10rpm/min) | 88.00±1 | 11.00±1/11.50±1 | ≥1×10¹⁰ | ≤80/≤80 | 8/8 | 0-10 | 6/6 |
| Temporary Solder Paste | WT0-LF-9400-GF | SAC305/105/307 | ROL0 | T3/T4/T5 | 1. Excellent continuous printing; 2. Wide reflow window, full bright solder coverage post-soldering; 3. Minimal residue, reliable electrical properties; 4. Residue is water-washable. | Printing: 160±20, Dispensing: 60-130 (10rpm/min) | 88.00±2 | 12.00±2.0 | ≥1×10¹⁰ | 20-100 | 8 | 0-10 | 6 |
| Printing Solder Paste | WT0-LF-9100-PY | SAC305 | ROL1 | T4/T5 | 1. Compatible with alloy plate soldering; 2. High soldering strength. | 30-100 (10rpm/min) | 84.00±2.0 | 16.00±2.0 | ≥1×10¹⁰ | - | 8 | 0-10 | 3 |
| Water-Washable SMT Solder Paste | SnCu0.7YM116WS-2 / SAC305YM116WS-2 | SC007/SAC305 | ROL1 | T4 | 1. Post-soldering residue is water-washable; 2. Excellent printing performance/stability. | 200±20/200±30 (10rpm/min) | 88.00±1/88.50±0.5 | 12.00±1.0/11.50±0.5 | -/≥1×10¹⁰ | ≤80/≤80 | 8/8 | 0-10 | 6/6 |
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