SAC305 Flux Core Solder Wire

Our SAC305 solder wire uses virgin raw materials (Sn purity >= 99.99%) to strictly maintain the standard 96.5% Tin, 3.0% Silver, and 0.5% Copper ratio.

Mechanical Strength: The 3.0% silver content increases shear and tensile strength compared to standard binary tin-copper alloys, preventing thermal fatigue in demanding operating environments.

Controlled Melting Point: The stable eutectic-like melting range (217C - 220C) ensures predictable thermal profiles for both hand-soldering stations and automated reflow/wave processes.

Void-Free Extrusion: Continuous inline laser monitoring during wire drawing ensures uniform diameter and eliminates internal flux gaps, preventing sputtering or dry joints during continuous soldering.

Wetting Efficiency: The optimized core formulation rapidly removes surface oxides on copper pads and component leads, achieving fast wetting speeds and complete fillet coverage without bridging defects.

Residue Control: Engineered for minimal post-soldering residue. No-clean variants leave clear, non-conductive, and non-corrosive residues that meet strict industry cleanliness standards.

Designed to meet RoHS compliance and lead-free mandates across multiple electronics sectors:

Direct Manufacturer Pricing: Eliminates intermediary markups, providing stable volume pricing for distributors, wholesalers, and contract manufacturers.

Alloy & Flux Flexibility: Beyond standard SAC305, we supply alternative lead-free formulations including SAC0307 and Sn99.3Cu0.7, paired with custom activity levels of flux.

Private Labeling: Custom spool sizes, branded carton designs, and laser-etched spool labels available for global distribution partners.